Power chips are connected to outside circuits via product packaging, and their efficiency relies on the support of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip interconnection describes the electric link on the upper surface area of the chip, which is usually light weight aluminum bonding cable in standard modules. ^
Standard power component plan cross-section
At present, business silicon carbide power modules still mostly make use of the product packaging innovation of this wire-bonded traditional silicon IGBT component. They encounter issues such as huge high-frequency parasitical specifications, inadequate warmth dissipation capability, low-temperature resistance, and inadequate insulation stamina, which limit the use of silicon carbide semiconductors. The screen of outstanding performance. In order to solve these issues and totally make use of the substantial possible advantages of silicon carbide chips, many brand-new packaging technologies and options for silicon carbide power components have emerged recently.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have developed from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have established from gold cords to copper cables, and the driving pressure is price decrease; high-power gadgets have actually created from aluminum cables (strips) to Cu Clips, and the driving force is to enhance product efficiency. The greater the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a solid copper bridge soldered to solder to connect chips and pins. Compared to standard bonding packaging approaches, Cu Clip innovation has the adhering to benefits:
1. The connection in between the chip and the pins is made from copper sheets, which, to a specific extent, changes the common wire bonding method between the chip and the pins. Therefore, a special package resistance worth, higher existing flow, and far better thermal conductivity can be obtained.
2. The lead pin welding location does not require to be silver-plated, which can completely save the price of silver plating and poor silver plating.
3. The item appearance is completely regular with normal products and is generally made use of in servers, portable computers, batteries/drives, graphics cards, electric motors, power materials, and various other areas.
Cu Clip has 2 bonding methods.
All copper sheet bonding technique
Both the Gate pad and the Source pad are clip-based. This bonding technique is more expensive and complex, however it can achieve better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus wire bonding technique
The resource pad uses a Clip technique, and the Gate makes use of a Cord technique. This bonding approach is somewhat less expensive than the all-copper bonding technique, conserving wafer area (appropriate to extremely tiny entrance areas). The process is less complex than the all-copper bonding approach and can obtain much better Rdson and much better thermal impact.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper roll, please feel free to contact us and send an inquiry.
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